Samsung Electronics confirmed on Thursday that it has started shipping its latest high-bandwidth memory (HBM4) chips to customers, marking a significant step in the intensifying race to supply critical components for artificial intelligence systems. The company anticipates its HBM sales will more than triple in 2026 as it ramps up production capacity for the new memory standard.
Market Reaction and Competitive Landscape
Samsung's shares jumped 6.4% following the announcement, reaching an all-time high, while shares of rival SK Hynix gained 3.3%. The company stated its HBM4 chips deliver a steady speed of 11.7 gigabits per second, which is approximately 22% faster than the previous HBM3E generation, with potential to reach up to 13 Gbps. Samsung also plans to send samples of an enhanced HBM4E variant in the second half of this year.
Competitors are also advancing rapidly. Both SK Hynix and Micron Technology reported they have begun HBM4 production and customer shipments. Micron's Chief Financial Officer, Mark Murphy, emphasized the company has "already entered mass production of HBM4 and started customer shipments," with yields and speeds exceeding 11 Gbps meeting targets. He notably added that Micron's entire HBM production for 2026 is already fully booked, underscoring immense market demand.
Strategic Importance and Future Outlook
HBM is a crucial enabler for AI, as it rapidly feeds vast amounts of data into processors like those from Nvidia, preventing bottlenecks in AI model training and inference. The global scramble to build AI data centers has turned advanced HBM into a high-margin, supply-constrained component. Samsung has historically trailed SK Hynix in this cutting-edge segment and is now aggressively working to close the gap.
Samsung's Chief Technology Officer, Song Jai-hyuk, reported receiving "very satisfactory" customer feedback on the new chips. The company, along with its rivals, remains bullish on long-term demand, with a Samsung executive previously stating that AI is expected to fuel robust demand for memory chips through at least 2027.
However, the race is not without risks. Manufacturing yields and rigorous qualification processes by major customers can create shipment delays or pricing pressures. While Samsung did not disclose its HBM4 customers, the entire industry is vying for positions in next-generation AI hardware platforms.
